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India Launches Semicon 2.0 to Secure Global Chip Dominance

India is pivoting toward semiconductor self-reliance with the launch of the Semicon India Programme 2.0, a sweeping industrial strategy designed to bridge the gap between burgeoning electronics manufacturing and high-end chip production by integrating design, fabrication, and a specialized workforce under one national umbrella.

India Launches Semicon 2.0 to Secure Global Chip Dominance

The initiative arrives on the heels of a decade-long surge in domestic electronics, where mobile phone production expanded thirty-two-fold and total electronics exports rose eleven times. This industrial foundation now supports 12 government-approved projects across six states, with facilities like Micron ATMP, Kaynes Semicon, and CG Power already moving into commercial production. Two additional plants are slated to come online before the year ends.

Beyond physical fabrication, the country is leveraging its existing design dominance—home to nearly 20 percent of the world’s chip design talent. Through the Design Linked Incentive Scheme, officials have cleared 24 design projects and over 100 Electronic Design Automation applications. Academic integration remains a priority, with the Chips to Startup initiative placing design tools in 320 institutions and training 68,000 students.

To scale these efforts, the government is formalizing partnerships with the United States, Japan, Singapore, Germany, the Netherlands, and the European Union. Major industry players including AMD, Applied Materials, and Lam Research have already committed to investments that align with the programme's six pillars: design, fabrication, advanced packaging, equipment, materials, and research. By targeting these specific niches, India aims to transition from an assembly hub to a primary node in the global semiconductor supply chain.

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